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  december 2012 hvm-1055-f 1 < hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules CM1000E4C-66R ? i c 1000a ? v ces 3300v ? 1-element in a pack (for brake chopper) ? insulated type ? lpt-igbt / soft recovery diode ? alsic baseplate application traction drives, high reliability conv erters / inverters, dc choppers outline drawing & circuit diagram dimensions in mm
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 2 maximum ratings symbol item conditions ratings unit v ge = 0v, t j = -40?+150c 3300 v ces collector-emitter voltage v ge = 0v, t j = ? 50c 3200 v v ges gate-emitter voltage v ce = 0v, t j = 25c 20 v i c dc, t c = 95c 1000 a i crm collector current pulse (note 1) 2000 a i e dc 1000 a i erm emitter current (note 2) pulse (note 1) 2000 a p tot maximum power dissipation (note 3) t c = 25c, igbt part 10400 w v iso isolation voltage rms, sinusoidal, f = 60hz, t = 1 min. 6000 v v e partial discharge extinction voltage rms, sinusoidal, f = 60hz, q pd 10 pc 2600 v t j junction temperature ? 50 ~ +150 c t jop operating junction temperature ? 50 ~ +150 c t stg storage temperature ? 55 ~ +150 c t psc short circuit pulse width v cc = 2500v, v ce v ces , v ge =15v, t j =150c 10 ? s electrical characteristics limits symbol item conditions min typ max unit t j = 25c ? ? 4.0 t j = 125c ? 4.0 ? i ces collector cutoff current v ce = v ces , v ge = 0v t j = 150c ? 24.0 ? ma v ge(th) gate-emitter threshold voltage v ce = 10 v, i c = 100 ma, t j = 25c 5.7 6.2 6.7 v i ges gate leakage current v ge = v ges , v ce = 0v, t j = 25c ? 0.5 ? 0.5 a c ies input capacitance ? 140.0 ? nf c oes output capacitance ? 8.7 ? nf c res reverse transfer capacitance v ce = 10 v, v ge = 0 v, f = 100 khz t j = 25c ? 4.0 ? nf q g total gate charge v cc = 1800v, i c = 1000a, v ge = 15v ? 10.7 ? c t j = 25c ? 2.45 ? t j = 125c ? 3.10 3.70 v cesat collector-emitter saturation voltage i c = 1000 a (note 4) v ge = 15 v t j = 150c ? 3.25 ? v t j = 25c ? 1.00 ? t j = 125c ? 0.95 1.25 t d(on) turn-on delay time t j = 150c ? 0.95 1.25 s t j = 25c ? 0.28 ? t j = 125c ? 0.30 0.50 t r turn-on rise time t j = 150c ? 0.30 0.50 s t j = 25c ? 1.40 ? t j = 125c ? 1.85 ? e on(10%) turn-on switching energy (note 5) t j = 150c ? 2.00 ? j t j = 25c ? 1.50 ? t j = 125c ? 1.95 ? e on turn-on switching energy (note 6) v cc = 1800 v i c = 1000 a v ge = 15 v r g(on) = 2.4 ? l s = 150 nh inductive load t j = 150c ? 2.15 ? j t j = 25c ? 2.70 ? t j = 125c ? 2.80 3.30 t d(off) turn-off delay time t j = 150c 2.85 3.30 s t j = 25c ? 0.30 ? t j = 125c ? 0.35 1.00 t f turn-off fall time t j = 150c ? 0.40 1.00 s t j = 25c ? 1.35 ? t j = 125c ? 1.65 ? e off(10%) turn-off switching energy (note 5) t j = 150c 1.70 ? j t j = 25c ? 1.50 ? t j = 125c ? 1.80 ? e off turn-off switching energy (note 6) v cc = 1800 v i c = 1000 a v ge = 15 v r g(off) = 8.4 ? l s = 150 nh inductive load t j = 150c ? 1.90 ? j
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 3 electrical characteristics (continuation) limits symbol item conditions min typ max unit t j = 25c ? 2.15 ? t j = 125c ? 2.30 2.80 v ec emitter-collector voltage (note 2) i e = 1000 a (note 4) v ge = 0 v t j = 150c ? 2.25 ? v t j = 25c ? 0.50 ? t j = 125c ? 0.70 t rr reverse recovery time (note 2) t j = 150c ? 0.80 ? s t j = 25c ? 850 ? t j = 125c ? 1000 ? i rr reverse recovery current (note 2) t j = 150c ? 1050 ? a t j = 25c ? 700 ? t j = 125c ? 1150 q rr reverse recovery charge (note 2) t j = 150c ? 1350 ? c t j = 25c 0.70 ? t j = 125c ? 1.20 e rec(10%) reverse recovery energy (note 2) (note 5) t j = 150c ? 1.35 ? j t j = 25c 0.80 ? t j = 125c ? 1.35 e rec reverse recovery energy (note 2) (note 6) v cc = 1800 v i c = 1000 a v ge = 15 v r g(on) = 2.4 ? l s = 150 nh inductive load t j = 150c ? 1.55 ? j thermal characteristics limits symbol item conditions min typ max unit r th (j -c ) q junction to case, igbt part ? ? 12.0 k/kw junction to case, fwdi part ? ? 22.5 k/kw r th(j-c)d thermal resistance junction to case, clamp-di part ? ? 22.5 k/kw r th ( c-s ) contact thermal resistance case to heat sink, ? g rease = 1w/m k, d ( c-s ) = 100 ? m ? 7.0 ? k/kw mechanical characteristics limits symbol item conditions min typ max unit m t m8 : main terminals screw 7.0 ? 22.0 nm m s m6 : mounting screw 3.0 ? 6.0 nm m t mounting torque m4 : auxiliary terminals screw 1.0 ? 3.0 nm m mass ? 1.2 ? kg cti comparative tracking index 600 ? ? ? d a clearance 19.5 ? ? mm d s creepage distance 32.0 ? ? mm collector to emitter ? 16.5 ? nh l p ce parasitic stray inductance anode to cathode ? 33.0 ? nh r cc?+ee? internal lead resistance t c = 25c, collector to emitter ? 0.18 ? m ? r aa ?+kk? internal lead resistance t c = 25c, anode to cathode ? 0.36 ? m ? r g internal gate resistance t c = 25c ? 2.25 ? ? ? note1. pulse width and repetition rate shoul d be such that junction temperature (t j ) does not exceed t opmax rating(150c). 2. the symbols represent characteri stics of the anti-parallel, emitte r to collector free-wheel diode (fwd i ) and the brake chopper, anode to cathode clamp diode (clamp-di). 3. junction temperature (t j ) should not exceed t jmax rating (150c). 4. pulse width and repetition rate should be such as to cause negligible temperature rise. 5. e on(10%) / e off(10%) / e rec(10%) are the integral of 0.1v ce x 0.1i c x dt. 6. definition of all items is according to iec 60747, unless otherwise specified.
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 4 performance curves output characteristics (typical) 0 40 0 80 0 1200 1600 2000 0123456 collector - emitter voltage [v] coll ector current [a] v ge = 9v v ge = 11 v v ge = 15v v ge = 13 v t j = 1 50 c v ge = 19v collector-emitter saturation voltag e characteristics (typical) 0 400 800 12 00 16 00 20 00 012345 collector-emitter saturation voltage [v] coll ector current [a] v ge = 15 v tj = 1 50 c tj = 1 25 c tj = 25c transfer characteristics (typical) 0 40 0 80 0 1200 1600 2000 024 681012 gate - emi tter voltage [v] coll ector current [a] tj = 25 c v ce = v ge tj = 1 50 c free-wheel diode forward characteristics (typical) 0 400 800 12 00 16 00 20 00 012345 emitter-collector voltage [v] emi tter current [a] tj = 1 50 c t j = 25 c t j = 1 25 c
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 5 performance curves capacitance characteristics (typical) 1 10 100 10 00 0.1 1 10 100 coll ector-emitter voltage [v] capa citance [nf] ci es v ge = 0v, tj = 25c f = 10 0khz co es cres half-bridge switching energy characteristics (typical) 0 1 2 3 4 5 6 7 0 40 0 80 0 1 20 0 1 60 0 20 00 collector current [a] switching energies [j/pulse] ere c v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , r g( off) = 8.4 ? l s = 150nh, tj = 125c in duct ive l oa d eo ff eon gate charge characteristics (typical) -1 5 -1 0 -5 0 5 10 15 20 0481216 gate charge [c] gate-emitter voltage [v] v ce = 18 00v, i c = 1000a tj = 2 5 c half-bridge switching energy characteristics (typical) 0 1 2 3 4 5 6 7 0 40 0 80 0 1 20 0 1 60 0 20 00 collector current [a] switching energies [j/pulse] erec v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , r g( off) = 8.4 ? l s = 150nh, tj = 150c in duct ive l oa d eo ff eon
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 6 performance curves half-bridge switching energy characteristics (typical) 0 1 2 3 4 5 6 7 0 5 10 15 20 gate res ist or [ ohm] switching energies [j/pulse] erec v cc = 1800v, i c = 10 00a v ge = 15 v , l s = 15 0nh t j = 12 5c , i ndu cti ve lo ad eon eoff half-bridge switching time characteristics (typical) 0.0 1 0.1 1 10 10 0 10 0 10 00 1 00 00 collec t or c urrent [a] switching times [s] tf v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , r g( off) = 8.4 ? l s = 1 50n h, t j = 1 25 c i n duct ive l oa d tr t d (on) td(off) half-bridge switching energy characteristics (typical) 0 1 2 3 4 5 6 7 05101520 gate res ist or [ ohm] switching energies [j/pulse] ere c v cc = 1800v, i c = 10 00a v ge = 15 v , l s = 15 0nh t j = 15 0c , i ndu cti ve lo ad eon eo ff half-bridge switching time characteristics (typical) 0.0 1 0.1 1 10 10 0 10 0 10 00 1 00 00 collec t or c urrent [a] switching times [s] tf v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , r g( off) = 8.4 ? l s = 1 50n h, t j = 1 50 c i n duct ive l oa d tr td(on) td(off)
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 7 performance curves free-wheel diode reverse recovery characteristics (typical) 0.1 1 10 10 0 100 1000 10000 emitter current [a] reverse recovery time [s] 10 100 1000 10000 reverse recovery current [a] trr irr v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , l s = 150 nh tj = 1 25 c, i n duct ive l oa d transient thermal impedance characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0. 001 0.01 0.1 1 10 tim e [s ] normalized transient thermal impedance r th(j-c )q = 12 .0 k/kw r th(j-c )d = 22. 5k/ kw free-wheel diode reverse recovery characteristics (typical) 0.1 1 10 10 0 100 1000 10000 emitter current [a] reverse recovery time [s] 10 100 1000 10000 reverse recovery current [a] trr irr v cc = 18 00 v, v ge = 15v r g(on) = 2.4 ? , l s = 150 nh tj = 1 50 c, i n duct ive l oa d ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? exp1 1 )( )( ? i t n i i cjth rz t 1234 r i [k/kw] : 0.0096 0.1893 0.4044 0.3967 ? i [sec] : 0.0001 0.0058 0.0602 0.3512
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 8 performance curves reverse bias safe operating area (rbsoa) 0 10 00 20 00 30 00 40 00 0 1000200030004000 collecto r-emitter voltage [v] coll ector current [a] v cc ? 25 00 v, v ge = 15v tj = 150 c, r g(o ff) = 8. 4 ? free-wheel diode reverse recovery safe operating area (rrsoa) 0 10 00 20 00 30 00 40 00 0 1000200030004000 emitter-collector voltage [v] reverse recovery current [a] v cc ? 25 00 v, di /d t < 6 ka/ s tj = 150 c short circuit safe operating area (scsoa) 0 4 8 12 16 0 1 000 20 00 3 000 40 00 collector-emitter voltage [v] coll ector current [ka] v cc ? 25 00v, v ge = 1 5v r g(on) = 2.4 ? , r g( off) = 8.4 ? t j = 1 50 c
< hvigbt modules > CM1000E4C-66R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 (hvm-1055-f) 9 ? 2011 mitsubishi electric corporation. all rights reserved. keep safety first in your circuit designs! mitsubishi electric corporation puts the maximum effo rt into making semiconductor products better and more reliable, but there is alwa ys the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials ?these materials are intended as a reference to assist our customers in the selection of the mitsubishi semiconductor product best suited to the customer?s application; they do not convey any license under any intellectual property rights, or any ot her rights, belonging to mitsubishi elec tric corporation or a third party. ?mitsubishi electric corporation assumes no res ponsibility for any damage, or infringement of any third-party?s rights, originating in the use of any pr oduct data, diagrams, charts, programs, algorithms, or circuit application examples c ontained in these materials. ?all information contained in thes e materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by mitsubishi electric cor poration without notice due to product improvements or other reasons. it is therefore recommended that customers contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor for the latest product info rmation before pu rchasing a product listed herein. the information described here may contain technica l inaccuracies or typographical errors. mitsubishi electric corporation assumes no re sponsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to info rmation published by mitsubishi electr ic corporation by various means, including the mitsubishi semiconductor home page (http://www. m itsubishielectric.com/). ?when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, pleas e be sure to evaluate all informati on as a total system before making a final decision on the applic ability of the information and products. mi tsubishi electric corporation assumes no responsibility for any damage, liabilit y or other loss resulting from the information contained herein. ?mitsubishi electric corporation semiconductors are not designed or m anufactured for use in a device or system that is used under circum stances in which human life is potentially at stake. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor when considering the use of a pr oduct contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aeros pace, nuclear, or undersea repeater use. ?the prior written approval of mitsubishi electric corporat ion is necessary to reprint or reproduce in whole or in part these materials. ?if these products or technologies ar e subject to the japanese export cont rol restrictions, they must be exported under a license from the ja panese government and cannot be im ported into a country other than the approved destination. any diversion or re-export contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. ?please contact mitsubishi electric corporation or an authorized mitsubi shi semiconductor product distributor for further details on these material s or the products contained therein.


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